Granted Patent
Utility
US 6,624,515 · App. 10/095,362
Microelectronic die including low RC under-layer interconnects
Inventor:
Jay Parks
Patented Case
View Patent ↗
Granted: Sep 23, 2003
Filed: Mar 11, 2002
Inventor
Jay Parks
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.