IP Library › Granted Patent US 6,624,516
Granted Patent Utility
US 6,624,516 · App. 09/978,005

Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer

Inventors: Masahiko Fujisawa, Akihiko Ohsaki, Noboru Morimoto
Patented Case View Patent ↗
Granted: Sep 23, 2003 Filed: Oct 17, 2001
Inventors
Masahiko Fujisawa
Akihiko Ohsaki
Noboru Morimoto
Assignee (at issue)
MITSUBISHI ELECTRIC CORPORATION

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Quick Facts
Patent No.
US 6,624,516
App. No.
09/978,005
Filed
2001-10-17
Granted
2003-09-23
Kind
B2