Granted Patent
Utility
US 6,627,479 · App. 10/022,572
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
Inventors:
Yoshitaka Aiba, Mitsutaka Sato, Toshio Hamano
Patented Case
View Patent ↗
Granted: Sep 30, 2003
Filed: Dec 20, 2001
Inventors
Yoshitaka Aiba
Mitsutaka Sato
Toshio Hamano
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.