Granted Patent
Utility
US 6,627,480 · App. 10/003,343
Stacked semiconductor package and fabricating method thereof
Inventor:
Sun-Dong Kim
Patented Case
View Patent ↗
Granted: Sep 30, 2003
Filed: Dec 6, 2001
Inventor
Sun-Dong Kim
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.