Granted Patent
Utility
US 6,627,976 · App. 09/687,331
Leadframe for semiconductor package and mold for molding the same
Inventors:
Young Suk Chung, Hyung Ju Lee, Jae Hak Yee
Patented Case
View Patent ↗
Granted: Sep 30, 2003
Filed: Oct 13, 2000
Inventors
Young Suk Chung
Hyung Ju Lee
Jae Hak Yee
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.