IP Library › Granted Patent US 6,627,985
Granted Patent Utility
US 6,627,985 · App. 10/012,057

Reconfigurable processor module comprising hybrid stacked integrated circuit die elements

Inventors: Jon M. Huppenthal, D. James Guzy
Patented Case View Patent ↗
Granted: Sep 30, 2003 Filed: Dec 5, 2001
Inventors
Jon M. Huppenthal
D. James Guzy
Assignee (at issue)
Arbor Company, LLLP

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,627,985
App. No.
10/012,057
Filed
2001-12-05
Granted
2003-09-30
Kind
B2