Granted Patent
Utility
US 6,630,727 · App. 09/655,603
Modularly expandable multi-layered semiconductor component
Inventors:
Gunter Tutsch, Thomas Münch
Patented Case
View Patent ↗
Granted: Oct 7, 2003
Filed: Sep 5, 2000
Inventors
Gunter Tutsch
Thomas Münch
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.