Granted Patent
Utility
US 6,632,706 · App. 09/607,363
Three dimensional structure integrated circuit fabrication process
Inventor:
Glenn J. Leedy
Patented Case
View Patent ↗
Granted: Oct 14, 2003
Filed: Jun 30, 2000
Inventor
Glenn J. Leedy
Assignee (at issue)
Elm Technology Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.