Granted Patent
Utility
US 6,635,395 · App. 09/927,238
Method for exposing a layout comprising multiple layers on a wafer
Inventors:
Peter Hahmann, Eckart Bergmann
Patented Case
View Patent ↗
Granted: Oct 21, 2003
Filed: Aug 13, 2001
Inventors
Peter Hahmann
Eckart Bergmann
Assignee (at issue)
Leica Microsystems Lithography
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.