Granted Patent
Utility
US 6,635,509 · App. 10/120,528
Wafer-level MEMS packaging
Inventor:
Luc Ouellet
Patented Case
View Patent ↗
Granted: Oct 21, 2003
Filed: Apr 12, 2002
Inventor
Luc Ouellet
Assignee (at issue)
DALSA Semiconductor Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.