IP Library › Granted Patent US 6,636,825
Granted Patent Utility
US 6,636,825 · App. 09/364,832

Component level, CPU-testable, multi-chip package using grid arrays

Inventors: Deviprasad Malladi, Renukanthan Raman, Christopher Furman
Patented Case View Patent ↗
Granted: Oct 21, 2003 Filed: Jul 30, 1999
Inventors
Deviprasad Malladi
Renukanthan Raman
Christopher Furman
Assignee (at issue)
Sun Microsystems Inc.

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Quick Facts
Patent No.
US 6,636,825
App. No.
09/364,832
Filed
1999-07-30
Granted
2003-10-21
Kind
B1