IP Library › Granted Patent US 6,638,146
Granted Patent Utility
US 6,638,146 · App. 10/022,415

Retention plate for polishing semiconductor substrate

Inventor: Naoya Naruo
Patented Case View Patent ↗
Granted: Oct 28, 2003 Filed: Dec 20, 2001
Inventor
Naoya Naruo
Assignee (at issue)
Sumitomo Mitsubishi Silicon Corporation

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Quick Facts
Patent No.
US 6,638,146
App. No.
10/022,415
Filed
2001-12-20
Granted
2003-10-28
Kind
B2