Granted Patent
Utility
US 6,638,410 · App. 10/302,711
Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
Inventors:
Linlin Chen, Thomas C. Taylor
Patented Case
View Patent ↗
Granted: Oct 28, 2003
Filed: Nov 22, 2002
Inventors
Linlin Chen
Thomas C. Taylor
Assignee (at issue)
Semitool, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.