Granted Patent
Utility
US 6,638,411 · App. 09/492,138
Method and apparatus for plating substrate with copper
Inventors:
Koji Mishima, Mizuki Nagai, Ryoichi Kimizuka, Tetsuo Matsuda, Hisashi Kaneko
Patented Case
View Patent ↗
Granted: Oct 28, 2003
Filed: Jan 27, 2000
Inventors
Koji Mishima
Mizuki Nagai
Ryoichi Kimizuka
Tetsuo Matsuda
Hisashi Kaneko
Assignees (at issue)
EBARA CORPORATION
Kabushiki Kaisha Toshiba
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.