Granted Patent
Utility
US 6,638,791 · App. 10/197,944
Techniques for maintaining alignment of cut dies during substrate dicing
Inventor:
Alois Tieber
Patented Case
View Patent ↗
Granted: Oct 28, 2003
Filed: Jul 16, 2002
Inventor
Alois Tieber
Assignee (at issue)
Intercon Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.