Granted Patent
Utility
US 6,638,860 · App. 09/963,382
Method and apparatus for processing substrates and method for manufacturing a semiconductor device
Inventors:
Tatsuhisa Matsunaga, Masahiro Teramoto, Norio Akutsu, Kouichi Noto
Patented Case
View Patent ↗
Granted: Oct 28, 2003
Filed: Sep 27, 2001
Inventors
Tatsuhisa Matsunaga
Masahiro Teramoto
Norio Akutsu
Kouichi Noto
Assignee (at issue)
Hitachi Kokusai Electric Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.