Granted Patent
Utility
US 6,639,308 · App. 09/687,876
Near chip size semiconductor package
Inventors:
Sean T. Crowley, Angel Orabuena Alvarez, Jun Young Yang
Patented Case
View Patent ↗
Granted: Oct 28, 2003
Filed: Oct 13, 2000
Inventors
Sean T. Crowley
Angel Orabuena Alvarez
Jun Young Yang
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.