Granted Patent
Utility
US 6,645,643 · App. 09/844,505
Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
Inventors:
Roberto Zafarana, Antonino Scandurra, Salvatore Pignataro, Yuichi Tenya, Akira Yoshizumi
Patented Case
View Patent ↗
Granted: Nov 11, 2003
Filed: Apr 27, 2001
Inventors
Roberto Zafarana
Antonino Scandurra
Salvatore Pignataro
Yuichi Tenya
Akira Yoshizumi
Assignees (at issue)
STMICROELECTRONICS S.r.l.
Toshiba Chemical Kawaguchi Works
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.