Granted Patent
Utility
US 6,653,658 · App. 10/189,731
Semiconductor wafers with integrated heat spreading layer
Inventor:
Stephen J. Burden
Patented Case
View Patent ↗
Granted: Nov 25, 2003
Filed: Jul 3, 2002
Inventor
Stephen J. Burden
Assignee (at issue)
Isonics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.