IP Library › Granted Patent US 6,657,301
Granted Patent Utility
US 6,657,301 · App. 10/022,352

Contact structure, method of forming the same, semiconductor device, and method of manufacturing the same

Inventors: Kazuyoshi Maekawa, Yasuhiro Kanda
Patented Case View Patent ↗
Granted: Dec 2, 2003 Filed: Dec 20, 2001
Inventors
Kazuyoshi Maekawa
Yasuhiro Kanda
Assignee (at issue)
MITSUBISHI ELECTRIC CORPORATION

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Quick Facts
Patent No.
US 6,657,301
App. No.
10/022,352
Filed
2001-12-20
Granted
2003-12-02
Kind
B2