Granted Patent
Utility
US 6,657,302 · App. 09/464,811
Integration of low dielectric material in semiconductor circuit structures
Inventors:
Huili Shao, Susan Clay Vitkavage, Allen Yen
Patented Case
View Patent ↗
Granted: Dec 2, 2003
Filed: Dec 17, 1999
Inventors
Huili Shao
Susan Clay Vitkavage
Allen Yen
Assignee (at issue)
Agere Systems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.