Granted Patent
Utility
US 6,659,328 · App. 10/017,598
Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board
Inventor:
Robert Dances
Patented Case
View Patent ↗
Granted: Dec 9, 2003
Filed: Dec 18, 2001
Inventor
Robert Dances
Assignee (at issue)
Xerox Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.