IP Library › Granted Patent US 6,659,512
Granted Patent Utility
US 6,659,512 · App. 10/199,441

Integrated circuit package employing flip-chip technology and method of assembly

Inventors: Timothy V. Harper, Greg L. Allen
Patented Case View Patent ↗
Granted: Dec 9, 2003 Filed: Jul 18, 2002
Inventors
Timothy V. Harper
Greg L. Allen
Assignee (at issue)
Hewlett-Packard Development Company, L.P.

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Quick Facts
Patent No.
US 6,659,512
App. No.
10/199,441
Filed
2002-07-18
Granted
2003-12-09
Kind
B1