Granted Patent
Utility
US 6,660,565 · App. 09/640,534
Flip chip molded/exposed die process and package structure
Inventor:
John Briar
Patented Case
View Patent ↗
Granted: Dec 9, 2003
Filed: Aug 17, 2000
Inventor
John Briar
Assignee (at issue)
ST Assembly Test Services Pte Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.