Granted Patent
Utility
US 6,660,633 · App. 10/083,809
Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed
Inventors:
Sergey Lopatin, Alexander H. Nickel
Patented Case
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Granted: Dec 9, 2003
Filed: Feb 26, 2002
Inventors
Sergey Lopatin
Alexander H. Nickel
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.