Granted Patent
Utility
US 6,660,943 · App. 10/019,299
Underfilling material for semiconductor package
Inventors:
Johshi Gotoh, Tatsuya Okuno
Patented Case
View Patent ↗
Granted: Dec 9, 2003
Filed: Mar 11, 2002
Inventors
Johshi Gotoh
Tatsuya Okuno
Assignees (at issue)
Sunstar Giken Kabushiki Kaisha
Uni-Sunstar B.V.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.