Granted Patent
Utility
US 6,661,102 · App. 10/053,994
Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress
Inventors:
Robert A. Newman, Jaime Weidler
Patented Case
View Patent ↗
Granted: Dec 9, 2003
Filed: Jan 18, 2002
Inventors
Robert A. Newman
Jaime Weidler
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.