IP Library › Granted Patent US 6,665,181
Granted Patent Utility
US 6,665,181 · App. 10/096,509

Cooling device capable of reducing thickness of electronic apparatus

Inventors: Atsuko Tanaka, Masuo Ohnishi
Patented Case View Patent ↗
Granted: Dec 16, 2003 Filed: Mar 13, 2002
Inventors
Atsuko Tanaka
Masuo Ohnishi
Assignee (at issue)
Fujitsu Limited

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Quick Facts
Patent No.
US 6,665,181
App. No.
10/096,509
Filed
2002-03-13
Granted
2003-12-16
Kind
B2