Granted Patent
Utility
US 6,670,718 · App. 10/021,257
Wiring board utilizing a conductive member having a reduced thickness
Inventors:
Akira Chinda, Akira Matsuura
Patented Case
View Patent ↗
Granted: Dec 30, 2003
Filed: Dec 19, 2001
Inventors
Akira Chinda
Akira Matsuura
Assignee (at issue)
HITACHI CABLE, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.