Granted Patent
Utility
US 6,673,653 · App. 09/792,257
Wafer-interposer using a ceramic substrate
Inventor:
John Pierce
Patented Case
View Patent ↗
Granted: Jan 6, 2004
Filed: Feb 23, 2001
Inventor
John Pierce
Assignee (at issue)
Eaglestone Partners I, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.