Granted Patent
Utility
US 6,673,654 · App. 10/087,910
Method of manufacturing semiconductor device using heated conveyance member
Inventors:
Takao Ohno, Koichi Meguro, Shigeru Kamada, Keisuke Fukuda, Yuzo Shimobeppu
Patented Case
View Patent ↗
Granted: Jan 6, 2004
Filed: Mar 5, 2002
Inventors
Takao Ohno
Koichi Meguro
Shigeru Kamada
Keisuke Fukuda
Yuzo Shimobeppu
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.