Granted Patent
Utility
US 6,674,305 · App. 10/189,748
Method of forming a semiconductor device and structure therefor
Inventors:
Senpeng Sheng, Frank Dover, Barry B. Heim
Patented Case
View Patent ↗
Granted: Jan 6, 2004
Filed: Jul 8, 2002
Inventors
Senpeng Sheng
Frank Dover
Barry B. Heim
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.