Granted Patent
Utility
US 6,677,662 · App. 09/687,487
Clamp and heat block assembly for wire bonding a semiconductor package assembly
Inventors:
Young Suk Chung, Soo Jung Park
Patented Case
View Patent ↗
Granted: Jan 13, 2004
Filed: Oct 13, 2000
Inventors
Young Suk Chung
Soo Jung Park
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.