Granted Patent
Utility
US 6,678,167 · App. 09/498,005
High performance multi-chip IC package
Inventors:
Yinon Degani, Thomas Dixon Dudderar, King Lien Tai
Patented Case
View Patent ↗
Granted: Jan 13, 2004
Filed: Feb 4, 2000
Inventors
Yinon Degani
Thomas Dixon Dudderar
King Lien Tai
Assignee (at issue)
Agere Systems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.