Granted Patent
Utility
US 6,682,958 · App. 10/103,889
Method for manufacturing semiconductor device by using sealing apparatus
Inventor:
Jiro Matsumoto
Patented Case
View Patent ↗
Granted: Jan 27, 2004
Filed: Mar 25, 2002
Inventor
Jiro Matsumoto
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.