Granted Patent
Utility
US 6,686,649 · App. 09/855,244
Multi-chip semiconductor package with integral shield and antenna
Inventors:
Douglas J. Mathews, Robert J. Hill, Michael P. Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher M. Scanlan
Patented Case
View Patent ↗
Granted: Feb 3, 2004
Filed: May 14, 2001
Inventors
Douglas J. Mathews
Robert J. Hill
Michael P. Gaynor
Ronald James Schoonejongen
John Armando Miranda
Christopher M. Scanlan
Assignees (at issue)
Amkor Technology, Inc.
Tyco Electronics Logistics AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.