Granted Patent
Utility
US 6,690,094 · App. 10/301,070
High aspect ratio metallization structures
Inventors:
Randle D. Burton, Shane P. Leiphart
Patented Case
View Patent ↗
Granted: Feb 10, 2004
Filed: Nov 20, 2002
Inventors
Randle D. Burton
Shane P. Leiphart
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.