Granted Patent
Utility
US 6,696,317 · App. 09/704,521
Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin
Inventor:
Hirokazu Honda
Patented Case
View Patent ↗
Granted: Feb 24, 2004
Filed: Nov 3, 2000
Inventor
Hirokazu Honda
Assignee (at issue)
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.