Granted Patent
Utility
US 6,700,077 · App. 10/164,356
Packaging substrate with electrostatic discharge protection
Inventor:
Juang-Sheng Chiang
Patented Case
View Patent ↗
Granted: Mar 2, 2004
Filed: Jun 6, 2002
Inventor
Juang-Sheng Chiang
Assignee (at issue)
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.