Granted Patent
Utility
US 6,700,142 · App. 10/330,069
Semiconductor wafer on which is fabricated an integrated circuit including an array of discrete functional modules
Inventor:
Richard Norman
Patented Case
View Patent ↗
Granted: Mar 2, 2004
Filed: Dec 30, 2002
Inventor
Richard Norman
Assignee (at issue)
Hyperchip Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.