IP Library Granted Patent US 6,706,422
Granted Patent Utility
US 6,706,422 · App. 09/994,834

Electroless Ni—B plating liquid, electronic device and method for manufacturing the same

Inventors: Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto, Hirokazu Ezawa, Masahiro Miyata, Manabu Tsujimura
Patented Case View Patent ↗
Granted: Mar 16, 2004 Filed: Nov 28, 2001
Inventors
Hiroaki Inoue
Kenji Nakamura
Moriji Matsumoto
Hirokazu Ezawa
Masahiro Miyata
Manabu Tsujimura
Assignees (at issue)
EBARA CORPORATION
Kabushiki Kaisha Toshiba

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Quick Facts
Patent No.
US 6,706,422
App. No.
09/994,834
Filed
2001-11-28
Granted
2004-03-16
Kind
B2