IP Library › Granted Patent US 6,707,141
Granted Patent Utility
US 6,707,141 · App. 09/934,094

Multi-chip module substrate for use with leads-over chip type semiconductor devices

Inventor: Salman Akram
Patented Case View Patent ↗
Granted: Mar 16, 2004 Filed: Aug 21, 2001
Inventor
Salman Akram
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 6,707,141
App. No.
09/934,094
Filed
2001-08-21
Granted
2004-03-16
Kind
B2