IP Library › Granted Patent US 6,707,161
Granted Patent Utility
US 6,707,161 · App. 10/185,103

Optical module package of flip chip bonding

Inventors: Jong Tae Moon, Yong Sung EOM
Patented Case View Patent ↗
Granted: Mar 16, 2004 Filed: Jun 27, 2002
Inventors
Jong Tae Moon
Yong Sung EOM
Assignee (at issue)
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

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Quick Facts
Patent No.
US 6,707,161
App. No.
10/185,103
Filed
2002-06-27
Granted
2004-03-16
Kind
B2