Granted Patent
Utility
US 6,709,312 · App. 10/180,740
Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process
Inventor:
Karl Mautz
Patented Case
View Patent ↗
Granted: Mar 23, 2004
Filed: Jun 26, 2002
Inventor
Karl Mautz
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.