Granted Patent
Utility
US 6,711,813 · App. 09/707,311
Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base
Inventors:
Eric Beyne, Francois Lechleiter
Patented Case
View Patent ↗
Granted: Mar 30, 2004
Filed: Nov 6, 2000
Inventors
Eric Beyne
Francois Lechleiter
Assignee (at issue)
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.