Granted Patent
Utility
US 6,713,714 · App. 09/889,677
Method and device for thermally connecting the contact surfaces of two substrates
Inventor:
Ghassem Azdasht
Patented Case
View Patent ↗
Granted: Mar 30, 2004
Filed: Jul 17, 2001
Inventor
Ghassem Azdasht
Assignees (at issue)
PAC TECH—PACKAGING TECHNOLOGIES GMBH
Smart Pac GmbH Technology Services
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.