IP Library › Granted Patent US 6,714,421
Granted Patent Utility
US 6,714,421 · App. 10/249,369

Flip chip package substrate

Inventors: Kun-Ching Chen, Ho-Ming Tong, Chun-Chi Lee
Patented Case View Patent ↗
Granted: Mar 30, 2004 Filed: Apr 3, 2003
Inventors
Kun-Ching Chen
Ho-Ming Tong
Chun-Chi Lee
Assignee (at issue)
ADVANCED SEMICONDUCTOR ENGINEERING, INC.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,714,421
App. No.
10/249,369
Filed
2003-04-03
Granted
2004-03-30
Kind
B2