Granted Patent
Utility
US 6,717,244 · App. 09/511,108
Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips
Inventors:
Junichi Hikita, Koji Yamamoto
Patented Case
View Patent ↗
Granted: Apr 6, 2004
Filed: Feb 23, 2000
Inventors
Junichi Hikita
Koji Yamamoto
Assignee (at issue)
ROHM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.