IP Library › Granted Patent US 6,722,945
Granted Patent Utility
US 6,722,945 · App. 10/261,636

Endface polishing method and endface polishing apparatus

Inventors: Kazumasa Katakura, Kouji Minami
Patented Case View Patent ↗
Granted: Apr 20, 2004 Filed: Sep 30, 2002
Inventors
Kazumasa Katakura
Kouji Minami
Assignee (at issue)
SEIKO INSTRUMENTS INC.

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Quick Facts
Patent No.
US 6,722,945
App. No.
10/261,636
Filed
2002-09-30
Granted
2004-04-20
Kind
B2