Granted Patent
Utility
US 6,724,084 · App. 09/499,384
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
Inventors:
Junichi Hikita, Goro Nakatani, Nobuhisa Kumamoto, Katsumi Sameshima, Kazutaka Shibata, Shigeyuki Ueda
Patented Case
View Patent ↗
Granted: Apr 20, 2004
Filed: Feb 7, 2000
Inventors
Junichi Hikita
Goro Nakatani
Nobuhisa Kumamoto
Katsumi Sameshima
Kazutaka Shibata
Shigeyuki Ueda
Assignee (at issue)
ROHM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.